Kinstech + SBT Limited

Fabricate Capability of FCB & Rigi-FlexPCB

*Product*	*Standard* *Flex PCB*	*Standard* *Rigid-flex PCB*	Remark
Standard Panel Size	250mm x 1500 mm	250mm x 500 mm
Line Width and Spacing	.003" (0.08mm)	.004" (0.1mm)
Copper Thickness	0.17 oz. and higher	1/2 to 1.5 oz.
Layer Count	8	Up to 6
Via/ Drill Size
Minimum Drill (Mechanical) Hole Diameter	.0039" (0.1 mm)	10%
Minimum Via (Laser) Size	-	10%
Minimum Micro Via (Laser) Size	2 mil (0.05 mm)	-
Stiffener Material	Polyimide / FR4 / Metal-SUS / PET	Polyimide / FR4 / Metal
Shielding Material	Copper / Silver Ink / Carbon / OSP / ENIG	Copper / Silver Ink / ENIG / OSP
Tooling Tolerance	2.7 mil (0.07 mm)	5.9 mil (0.15 mm)
Laser Tolerance	2 mil (0.05 mm)	4 mil (0.1 mm)
Solder Mask
Solder Mask Bridge Between Dam	4 mil (0.1 mm)	4 mil (0.1 mm)
Solder Mask Registration Tolerance	2 mil (0.05 mm)	2 mil (0.05 mm)
Coverlay
Coverlay winder space Tolerance	4 mil (0.1 mm)-drill via / 32 mil (0.8mm)puNching	4 mil (0.1 mm)-drill via / 32 mil (0.8mm)puNching
PI Material	PI1/2 / PI1 / PI2	4 mil (0.1 mm)-drill via / 32 mil (0.8mm)puching
Solder Mask Registration	4 mil (0.1 mm)	4 mil (0.1 mm)
Stiffener
PI Stiffener
Stiffener Registration	10 mil (0.25 mm)	10 mil (0.25 mm)
Thickness Tolerance	0.03mm	10%
FR4 Stiffener
Stiffener Registration	2 mil (0.05 mm) / 10% ( TH > 0.5mm only )	2 mil (0.05 mm) / 10% ( TH > 0.5mm only )
TG	130/170	130/170
Etching
Minimum Height	0.78 mil (0.02 mm)	1.2 mil (0.03 mm)
Minimum Width	4 mil (0.1 mm)	4 mil (0.1 mm)
Minimum Space	4 mil (0.1 mm)	4 mil (0.1 mm)
Tolerances	+/- 20%	+/- 20%
Impedance	+/- 20%